Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film

Abstract

Pulse deposition, which has an advantage to apply relatively high current density by supplement of Cu ions during off-time, was applied to deposit 250 nm Cu film. The microstructural change during off-time was to be investigated. The differences between constant potential and pulse deposition were due to the change during off-time. The application of pulse deposition led to the increase in the Cu(111) intensity and the reduction in the film resistivity compared to constant potential deposition. The film characteristics were further improved as the duty cycle decreased. The change during the off-time was verified to be grain growth in contact with the electrolyte. Additionally, it was clarified that the grain growth completed in a second, unlike self-annealing process, which proceeded for tens of hours, and affected within about 2.0 nm of Cu film from the surface. Under optimum conditions, pulse deposition led to 50% enhancement in Cu(111) intensity and 30% reduction in resistivity compared to the constant potential deposition.