Abstract
Pulse transmission integrity and crosstalk of bondwires buried in plastic packages are analyzed using the method of moments and the Fourier transform algorithm, showing that the quasi-static crosstalk model of simulation program with integrated circuit emphasis (SPICE) is inappropriate for designing high-speed plastic packages. Plastic packaging material, which increases the self and mutual capacitances, is found to be helpful for pulse transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the pulse crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, we observe that the radiation-enhanced coupling effect is significant for most typical bondwire geometries in common plastic molding materials. These calculation results can be effectively used for designing plastic-mold packages of high-speed digital integrated circuits and monolithic radio frequency integrated circuits (RFICs).
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
