Abstract
This paper describes how copper plating is influenced by modulated current. By unipolar pulse plating smooth, compact and fine grained structures can be obtained, but the macro throwing power is worse than by direct current plating. The best throwing power is obtained by pulse reverse plating. In additive containing solutions, excellent throwing power has been obtained at the following parameters: Tc/Ta=20, ia/ic=1–3·5 and Qa/Qc<0·2. Without additives the surface becomes less smooth. Finally, superimposed pulse reverse plating has the possibility to combine the advantages of uni- and bipolar pulse plating in an additive free process.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
