Pseudo lamellae of Cu6Sn5 on the crystal facet of Sn in electrodeposited eutectic Sn-Cu lead-free solder

Abstract

Eutectic Sn-Cu lead-free solder is developed using the pulse electrodeposition method from a citrate bath at different current densities like 0.1, 0.2, 0.4, and 0.5 A/cm2. The exact composition of all the deposits was confirmed through atomic absorption spectroscopy (AAS) analysis. The coating deposited at 0.2 A/cm2 constitutes 0.7 wt% of Cu which is similar to the eutectic Sn-Cu composition. Microstructural characterization was carried out with the help of a scanning electron microscope (SEM). Sn was the major constituent in all the deposits while a little amount of intermetallic i.e. Cu6Sn5 was present for the deposits at 0.1 and 0.2 A/ cm2. The energy dispersive spectroscopy (EDS) results showed traces of Cu6Sn5 in the deposits. The formation of Cu6Sn5 was also confirmed through X-ray diffraction (XRD). For the deposit at 0.2 A/cm2, the endothermic peak temperature in DSC is exactly the same as that of the melting point of Sn-Cu eutectic. This electrodeposited microstructure resembles the conventional eutectic Sn-Cu cast structure. The top view of the deposited Cu6Sn5 on the steps of Sn creates an illusion of lamellar structure. The effect of current density on the roughness was analyzed through AFM.