Abstract

The variation of electrostatic and transport characteristics of silicon-on-insulator fin field effect transistors (FinFETs) having sub-10 nm fin dimensions is investigated with the variation of top oxide thickness. Capacitance voltage and ballistic transport characteristics of double gate (DG) and triple gate (TG) FinFETs are obtained by self-consistently solving the coupled Schrödinger’s and Poisson’s equations. Performance enhancement can be obtained in terms of both on-state current and inversion capacitance by increasing the top oxide thickness of highly scaled FinFETs. The work suggests limiting values of the device parameter to differentiate the DG and TG variants of FinFET.

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