Abstract

This paper is focused on the properties of Thick Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper.

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