Abstract
In the present work, one near‐eutectic and three hypoeutectic Sn‐Ag‐Cu alloys have been employed for soldering by induction heating. The alloys were produced by induction melting of high purity Ag, Cu, and Sn lumps. The melting behavior of the alloys was investigated by differential scanning calorimetry. The solder alloys were subsequently applied for soldering by conventional hot‐plate heating as well as induction heating and both soldering times and peak temperatures were recorded during soldering. Solder joints of two copper sheets were produced. The electrical resistance, tensile strength, and microstructure were analyzed on each soldered joint. The results indicate that the physical and mechanical properties of solder joints are determined by their chemical composition and soldering technology. Induction soldered joints not only have a slightly higher electrical resistivity but also higher mechanical strength, except of the 0.3 wt.% Ag hypoeutectic solder. The highest increase in ultimate tensile strength (28%) was observed for induction soldered joints with 1 wt.% Ag hypoeutectic solder. This effect is ascribed to the homogenous distribution of the intermetallic compounds within the eutectic in the alloy microstructure. The homogenous distribution is aided by rotation of liquid solder due to eddy currents and high‐frequency magnetic field generated during induction heating.
Highlights
Ternary solders consisted of (Sn)-Ag-Cu alloys constitute a favorite replacement of traditional Sn-Pb solders in many applications. e Sn-AgCu solders have good wettability, solderability, and favorable mechanical and electrical properties
As we found in [5], the processing and utilization of such alloys could be hindered by oxidation of some of the alloying elements. is problem, could be prevented by dispersing oxide nanoparticles in the alloy
There is no comparative investigation of reflow soldering by conduction heating with soldering by induction heating. erefore, in this study we prepared four types of lead-free solder alloys with different Ag concentrations. e alloys were utilized for soldering by induction heating and the properties of solder joints were compared with those prepared by conductive heating. e electrical resistivity, ultimate tensile strength and microstructure of soldered joints have been investigated on the specimens prepared by both techniques
Summary
Ternary Sn-Ag-Cu alloys constitute a favorite replacement of traditional Sn-Pb solders in many applications. e Sn-AgCu solders have good wettability, solderability, and favorable mechanical and electrical properties. E hypoeutectic Sn-Ag-Cu alloys have a wider melting temperature range, worse wetting, coarse microstructure, and substandard mechanical strength in comparison with the eutectic solder alloy These drawbacks have been improved by microalloying with other metal elements located in the d- and f-group of the periodic table, as shown by both Sabri et al [1] and Silva et al [2]. It is recognized that the application of alternating electromagnetic field during solidification can affect the solute and heat transport in the melt, which improves the resulting microstructure. E alloys were utilized for soldering by induction heating and the properties of solder joints were compared with those prepared by conductive heating. There is no comparative investigation of reflow soldering by conduction heating with soldering by induction heating. erefore, in this study we prepared four types of lead-free solder alloys with different Ag concentrations. e alloys were utilized for soldering by induction heating and the properties of solder joints were compared with those prepared by conductive heating. e electrical resistivity, ultimate tensile strength and microstructure of soldered joints have been investigated on the specimens prepared by both techniques
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