Properties of porous copper filled electrically conductive adhesives

Abstract

In this study, three types of copper particles produced by wet chemical reduction method which include two different types of micron-size copper and a porous copper particles, were applied as metallic fillers in electrically conductive adhesive (ECA). Morphology of the Cu particles was observed by using scanning electron microscope (SEM). Properties of these three Cu filled ECAs were investigated and compared in terms of electrical and mechanical properties. Mechanical property of the ECA was evaluated through shear strength joint of the ECA with Cu specimens, and electrical property of the ECA was evaluated by using a standard four-point probe method. Significant difference could be found in the electrical percolation threshold of the ECAs prepared in this study. Lowest percolation filler content was observed in the porous Cu filled ECA whereas relatively high percolation filler content was found in the micron-size Cu filled ECAs.