Abstract
A novel type of inorganic high-temperature adhesive that can be cured at room temperature and applied to a high-temperature furnace was prepared using alumina and micro-silica as materials, liquid aluminum dihydrogen phosphate as a binder, and then sintered at a high temperature. To evaluate the mass ratio of Al2O3:SiO2 and the optimal sintering system, the physical properties of the adhesive after sintering were tested, and the phase and microstructure were characterized. The results revealed that the physical properties of the adhesive at 1300–1600 °C were better at a mass ratio of Al2O3:SiO2 = 5:1. When the sintering temperature was 1300 °C, columnar mullite was formed. At 1500 °C, the adhesive had a high shear strength.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
