Abstract
AbstractIn order to improve the electrical tree resistance of epoxy resin, composites were prepared using dihydroxydiphenylsilane and a novel silicone modifier modified epoxy resin and micron silica, and the composites were subjected to accelerated thermal aging test and electrical tree test and recorded the growth process of electrical trees to further obtain the characteristic parameters of electrical trees in the experimental samples. The results show that the silicone‐modified epoxy resin/silica composite has better thermal stability and electrical tree resistance than the unmodified epoxy resin/silica composite and pure epoxy resin. Analysis of the scanning electron microscope (SEM) and breakdown field strength results show that the introduction of the modifier enhanced interfacial properties between the epoxy resin and silica. At the end of the electrical tree test, the length of the electrical tree in the silicone‐modified epoxy resin/silica composite was at a minimum 25.31% of the length of the electrical tree in the unmodified epoxy resin/silica composite with the same silica filling ratio, and 9.19% of the length of the electrical tree in the pure epoxy, while the electrical trees in the silicone‐modified epoxy resin/silica composite have lower expansion factors, as well as higher fractal dimensions, compared to those in the resin without added silica.
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