Abstract
Ultrafine-grained pure copper produced by equal-channel angular pressing was subjected to hard cyclic viscoplastic deformation, consisting of large, stepwise increased strain amplitudes (ranging from ± 0.05% to ± 2.5%) of tension–compression loading at a frequency of 0.5 Hz at room temperature. Pronounced high-angle grain boundary formation and a decrease in dislocation density were observed, and as a result the electrical conductivity, viscoelasticity and ductility improved and were accompanied by a small decrease in hardness and strength.
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