Abstract
This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling sys- tems. The paper presents an analytical description of melting and freezing process, an analytical solution of CaCl2.6H2O phase change in 1D and the results of a numerical model of phase change. The numerical model joins thermal fleld, air ∞ow with respects to material phase change. This numerical model was obtained by means combined of the flnite element method (FEM) and flnite volume method (FVM) applied as main method in ANSYS software.
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