Propagation of guided waves in adhesive bonded components

Abstract

The objective of this research is to use analytical and computational models to develop a quantitative understanding of the propagation of guided Lamb waves in multi-layered, adhesive bonded components. Key issues of this study include the effect of the adhesive bond layer, including its low stiffness (relative to the adherends) and viscoelastic behavior. The propagation of these guided waves are interpreted in terms of dispersion relationships, displacement profiles and attenuation curves (both as functions of frequency and wavenumber). The ultimate goal of this study is to determine the effectiveness and sensitivity of guided Lamb waves to determine the in situ properties of an adhesive bond. A combination of the analytical model, transient FEM simulation and experimental measurements provides a better understanding of the guided wave's behavior in this layered waveguide.