Abstract
Tungsten has many excellent properties such as high melting point, high electrical conductivity, high electromigration resistance, high electron emission coefficient, high thermal stability and so on. Because of these excellent properties, high purity tungsten targets have wide applications and development prospects in the integrated circuit (IC) industry. In this paper, some manufacturing methods of tungsten targets was summarized and analyzed. The high melting point of tungsten makes powder metallurgy (PM) be the manufacturing methods of tungsten targets. After preforming of the tungsten powders, some sintering and densification processes like atmosphere pressure sintering, Hot Pressing (HP), Hot Isostatic Pressing(HIP) have been carried out. The grain size and the density of the tungsten targets is different by different manufacturing methods.
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