Progress on 3D tubular passive electronics: Residual stress-based fabrication, application, and modeling

Abstract

The platform concept and methodology to create three-dimensional (3D) tubular structures by releasing the stress of two-dimensional multilayer membranes has been demonstrated for the design and fabrication of advanced integrated passive electronics, which revolutionizes their design and fabrication, enabling extraordinarily strong electromagnetic coupling effects and high energy storage densities, for the miniaturization of a variety of systems. In this perspective, we highlight the important recent progress, which constitutes the scope of understanding of 3D tubular passive electronics, including fabrication techniques, applications, and multi-physics modeling. Basic 3D tubular inductive and capacitive components are discussed, in addition to complex and composite devices and systems such as transformers, filters, and antennas. Finally, state-of-the-art strategies to engineer reconfigurable 3D tubular structures are discussed, with the intention to inspire a more disruptive design of passive electronics.