Progress in I-Module: Towards Improved Performance, Reliability and Module-Level Fabrication Technologies for Back-Contact PV Modules Based on Ultra-Thin Silicon Solar Cells

Abstract

Imec is working on the i-module (interconnect-module) concepts, presented at last year’s EUPVSEC, as a roadmap towards improved modules based on back-contact solar cells. This concept aims at such improvements as increased performance and reliability and reduced cost through module-level integration and even fabrication of back-contact cells using silicone as adhesive and encapsulant. First the approach will be discussed and progress made since then will be elaborated: advances in coating, placement and interconnection scheme, as well as further reliability tests and modeling will be presented. Furthermore, imec is investigating possibilities for fabricating the cells (providing the junction and contacting both base and emitter from the back) when they are already fixed to the module. This approach is coined i 2 -module (integrated interconnect-module) and first trials targeting deposition of a heterojunction on silicon attached to glass will be presented, together with initial investigations on possible routes for front side processing of cells that might be too thin to be processed standalone. PROGRESS IN I-MODULE: TOWARDS IMPROVED PERFORMANCE, RELIABILITY AND MODULE-LEVEL FABRICATION TECHNOLOGIES FOR BACK-CONTACT PV MODULES BASED ON ULTRA-THIN SILICON SOLAR CELLS Jonathan Govaerts 1 , Riet Labie 1 , Stefano Granata 1 , Mario Gonzalez 1 , Barry O’Sullivan 1 , Anja Vanleenhove 1 , Jan Wera 1 , Adel Gougam 1 , Arul Kumar 1 , Twan Bearda 1 , Guy Beaucarne 2 , Arvid van der Heide 3 , Stefan Dewallef 4 , Jan Vanfleteren 5 , Ivan Gordon 1 and Kris Baert 1 1 imec, Leuven, Belgium 2 Dow Corning, Seneffe, Belgium 3 Photovoltech, Tienen, Belgium 4 Soltech, Tienen, Belgium 3 Cmst-imec/UGent, Gent SUMMARY: This paper presents the progress made at imec in its i-module concepts, towards integrating ultra-thin silicon solar cells into modules. First, it gives an update with respect to the work that was presented at the previous EUPVSEC conference, in terms of coating, placement and interconnection technology, as well as results obtained rin reliability and modeling. Then, the next step in the roadmap, going towards module-level fabrication of the solar cells, is elaborated: the approach is disccussed, and results that have been obtained are reported..