Abstract
In the last decade, microsystem engineering has rapidly developed. Nowadays microsystems have a very broad scope of applications, which range from electronics and aerospace to chemistry, optics, biology and medicine. Within this framework, the joining technique plays a crucial role. Therefore the development of new concepts for joining hybrid microstructures is one of the main tasks within the collaborative research center, assembly of hybrid microsystems. Active soldering and transient liquid phase (TLP) bonding processes are two innovative and trend-setting technologies in the field of joining dissimilar materials and have been specifically adapted to the requirements of the microsystems.
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