Abstract
Summary form only given. A short biography of Herbert Reichl is presented. Herbert Reichl holds the M.S. and Ph.D. degree in electrical engineering from the Technical University of Munich, Germany. He is director of Fraunhofer IZM, with more than 260 full time employees one of the leading institutes in the field of microelectronics and microsystem packaging worldwide and professor for Packaging and Interconnection Technologies at the Technical University Berlin, where he also heads the Research Center for Microperipheric Technologies. For the past two decades Prof. Reichl has been at the forefront of the development and application of innovative packaging and system integration technologies with activities in the field of material and characterization, design and simulation as well as high density interconnect and wafer level packaging, chip and board interconnection technologies, 3D-packaging and vertical chip integration, mechatronics, micromechanical systems, reliability and failure analysis, environmental engineering, polymer materials and composites, polytronic and flexible systems.
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