Production of Copper Powder by Electrodeposition with Different Equilibrium Crystal Shape

Abstract

The copper powder is electrodeposited from copper sulfate pentahydrate (CuSO4·5H2O) and sulphuric acid (H2SO4) bath. The polarization study is carried out to get an indication of limiting current density or deposition potential. Solutions are prepared with different concentrations of CuSO4·5H2O, i.e., from 0.015 to 0.35 M. Additives like sodium dodecyl sulfate (SDS) and cetyltrimethylammonium bromide (CTAB) are used during electrodeposition. To elucidate the effect of additive on the copper electrodeposition, an equal concentration of SDS and CTAB is used for a particular concentration of CuSO4·5H2O. The examination of surface topography is carried out with the help of a scanning electron microscope. In the absence of additive, the morphology is a honeycomb like structure. However, the deposits are dendritic in nature in the presence of the additive. The smallest constituent in the dendrites is different for both the additive added solutions. In the case of CTAB, the smallest constituent is a flower like structure where microspheres of copper are embedded with nanosheets. On the other hand, the faceted crystal appears for SDS added solution. SHAPE V 7.4 software is used to draw the equilibrium crystal shape. In summary, it is concluded that the dissimilarity in the smallest constituent of dendritic morphology is associated with the concentration of the surfactant.