Abstract
This paper introduces an X-ray reflective anode with a diamond heat buffer layer, so as to improve heat dissipation of micro-focus X-ray sources. This also aids in avoiding the destruction of the anode target surface caused by the accumulation of heat generated by the electron beam bombardment in the focal spot area. In addition to the description of the production process of the new reflective anode, this study focuses more on the research of the thermal conductivity and compounding ability. This paper also introduces a method that combines finite element analysis (FEA) in conjunction with thermal conductivity experiments, and subsequently demonstrates the credibility of this method. It was found that due to diamonds having a high thermal conductivity and melting point, high heat flux produced in the micro-focus spot region of the anode could be conducted and removed rapidly, which ensured the thermal stability of the anode. Experiments with the power parameters of the radiation source were also completed and showed an improvement in the power limit twice that of the original.
Highlights
In the field of X-ray imaging, the improvement of image resolution has always been a key point for research
4a is the no obvious gap orsoldering crack can bemagnified identified in the diamond heat buffer layer or the copper heatcomposite buffer layeranode, or the copper substratum
It can be concluded that was wetting composite of diamond anode’s smoothing and no obvious gap or crack can be identified in the diamond heat buffer layer soldering layer, magnified
Summary
In the field of X-ray imaging, the improvement of image resolution has always been a key point for research. In order to take advantage of the high efficiency of reflective X-ray anodes, as well as to solve the problem of heat dissipation, rotation anodes [6,7], liquid-metal anodes [8,9] and water cooled anodes [10] were invented. They were accompanied by anode vibration and structural complexity, which resulted in complicated computing for image analysis and limited the applications of the inventions. The utilizing diamond asdiamond heat buffer layerbuffer
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