Abstract
Abstract Ba(OH)2 was added in the synthesis of phenol-formaldehyde resin to realize a low-temperature and fast-bonding process for plywood production. Plywood bonding was investigated by studying a number of parameters, such as the glue spread, the amount of curing agent, and the temperature and duration of the hot-pressing process. The plywood bonding strength was characterized by the shear strength of the adhesive layer, and a mathematical model describing the process and the response was developed using a central composite design and response surface methods. The variance analysis revealed that the newly developed model was reliable, with a high signal-to-noise ratio. All the factors and their interactions were analyzed to optimize the bonding process. Thus, seven optimized processes were obtained from the model, and the optimal process conditions were revealed (glue spread: 277.8 g/m2; amount of curing agent: 3.5%; hot-pressing temperature: 108°C; and hot-pressing duration: 34.99 s/mm). The results from repeated average shear strength experiments of five veneer testing samples (1.64 MPa) verified the reliability of the optimized technics.
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