Abstract
AbstractThe present study attempts to apply HE to 99.99% pure copper. The microstructure of the samples was investigated by both light microscopy and scanning transmission electron microscopy (STEM). Additionally, the microhardness was measured, the tensile test was made, and statistical analysis of the grains and subgrains was performed. Based on Kikuchi diffraction patterns, misorientation was determined. The obtained results show that microstructure of copper deformed by hydrostatic extrusion (HE) is rather inhomogeneous. The regions strongly deformed with high dislocation density exist near cells and grains/subgrains free of dislocations. The measurements of the grain size have revealed that the sample with an initial in annealed-state grain size of about 250 μm had this grain size reduced to below 0.35μm when it was deformed by HE to the strain ε=2.91. The microhardness and UTS are stable within the whole investigated range of deformation.
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