Abstract
A simple process was used to fabricate 3D interconnected porous aluminum nitride composites. For this purpose aluminum powders were cold pressed and sintered under controlled conditions of temperature and time to initiate particle necking and coarsening, but with minimum shrinkage. The resultant compacts were characterized for their microstructure and density using optical microscopy and pycnometry measurements. The sintered compacts contain ≈ 28% porosity comprising of 5–75 μm pores which are well connected and continuous to the surface. The pores were then infiltrated with borosilicate glass to a depth of ≈ 30–80 μm. Such composites would potentially exhibit optimum dielectric and thermal conductivity values making them viable substrate materials for electronic packaging.
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