Abstract

AbstractSemiconductor technologies make major contributions to scientific and technological improvements, enabling high‐performance and low‐cost devices, chips, and systems. Photolithography technologies are at the heart of semiconductor technologies and are indispensable in fabricating microstructures and nanostructures. It is obvious that a new emerging material can play a greater role in economic development if it can be processed with photolithography technologies. Halide perovskites have received an enormous amount of attention, as they are useful in photonic and optoelectronic applications due to their strong optical absorption, tunable direct bandgap, and long electron–hole diffusion length. However, photolithography technologies cannot be utilized to fabricate semiconductor devices based on halide perovskite materials because water, a solvent for all halide perovskite materials, is used in the fabrication process. Here, the process compatibility between halide perovskite materials and semiconductor technology is realized with the help of parylene, a kind of polymer. A photodetector based on MAPbI3 and a memristor based on CsPbBr3 fabricated with photolithography technologies are both demonstrated successfully for the first time. This study not only paves the way toward the fabrication of halide perovskite devices with semiconductor technologies but also provides a powerful tool for the in‐depth study of halide perovskite materials.

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