Process simulation of nano-channel forming by thin film deposition

Abstract

In the traditional fabrication process of micro/nano-fluidic chips, thermal bonding is usually used for channel sealing, but it is easy to cause channel blockage, especially when the channel size is nanometer. The film deposition is a better way to seal the nano channel, and by controlling the deposition angle, the shape and size of the sealed channel can also be controlled. In order to understand the channel formation process of thin film deposition more intuitively, based on the COMSOL software, a free molecular flow module is used to simulate the film deposition process. The growth of the film is characterized by the post-processing of geometric deformation, so as to predict the channel shape. By comparing the simulation results with the experimental results, it can be seen that this simulation can explain the process of forming channels by angle-deposited films to a certain extent, and predict the channel size. In addition, the simulation results, in turn, can guide the film deposition process, so as to control the size of nano channel.