Process-Quality Evaluation for Wire Bonding With Multiple Gold Wires

Chun-Min Yu,Kuen-Suan Chen,Kuei-Kuei Lai,Tsang-Chuan Chang

doi:10.1109/access.2020.2998463

Abstract

Taiwan is a world-leader in wafer foundry services and IC packaging and testing. Wire bonding is a crucial process in the overall IC-packaging industry chain. Thus, this paper proposes a process-quality evaluation model for wire bonding with multiple gold wires. We chose process quality indices as a tool of evaluation fully mirroring process yield and quality levels. These indices contain unknown parameters and thus require sample data to estimate. We first derived the uniformly minimum variance unbiased estimator of the indices and calculated the upper confidence limits of the indices based on DeMorgan's theorem and Boole's inequality. The upper confidence limits of the indices were then employed to create a confidence interval-based fuzzy membership function, in order to improve the accuracy of estimation as well as solve the problem of uncertainty of the measured data. Next, we obtained the fuzzy critical value and used index estimates and the fuzzy critical value to establish fuzzy test rules. Next, we marked the fuzzy critical value on the axes of a radar chart, which is a visualization evaluation tool, and connected neighboring critical points to create a critical region in the form of a regular polygon. The observed values of the indices were then marked on the axes to produce a visualized fuzzy radar evaluation chart. This fuzzy radar evaluation chart has a solid foundation in statistical inference, and evaluation rules were established using precise fuzzy test methods. Not only is this fuzzy radar evaluation chart easy to use, but it also reduces the chance of misinterpretations made by sampling errors, so that the accuracy of evaluation can be enhanced.

Highlights

Taiwan’s wafer foundry output accounts for approximately 70% of the global market, and its IC packaging output occupies roughly 50% of the global market, marking Taiwan out as a world-leader in the industry
Using the abovementioned rules and the methodology proposed by Chen [20], we developed a fuzzy testing method based on the observed value of the upper confidence limit for index PQILjh
Both of the quality characteristics of the gold wires are LTB quality characteristics, and for this reason, we propose a process-quality index suitable for LTB quality characteristics based on the concepts presented by Chang et al [18]

Summary

Introduction

Taiwan’s wafer foundry output accounts for approximately 70% of the global market, and its IC packaging output occupies roughly 50% of the global market, marking Taiwan out as a world-leader in the industry. INDEX TERMS Process quality index, fuzzy critical value, critical region, wire bonding, radar chart. We propose a fuzzy process-quality evaluation model for wire bonding in IC packaging.

Results

Conclusion