Abstract
Adhesive film remains on the dicing tape is one of the problems encountered in diebonding or die attach process during the pick-up process of silicon dies. With this occurrence, one method used to identify the root cause is the process mapping from wafer preparation to diebonding. Adhesive film remains are found occurring during the process, affecting the manufacturability and assembly yield of the semiconductor package. By resorting to a new and improved die attach adhesive film material, occurrence of its remains was mitigated during the diebonding process.
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