Abstract
Abstract In this work, process parameters are developed for an Al-alloy wire for high-temperature power electronics. Shear and pull forces of the bonds on IGBT devices reach 2200 g and 1100 g respectively, without causing any die cratering. Comparison of the Al-alloy wire and standard Al wire bonded on battery cells shows that both the pull and shear forces of the bonds with the Al-alloy wire are improved by ~20%. This indicates that this Al-alloy wire potentially could be used for bonding on the power electronics and batteries in automotive industry, where better mechanical strength and wider bond window are required.
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