Process development for ball grid array assembly using a design of experiments approach

Abstract

The focus of this work was to develop a robust assembly process for low and high input/output (I/O) ball grid arrays (BGAs). The test vehicles considered had a wide variety of components including full and perimeter array BGAs, and ultrafine pitch peripheral leaded devices. Experimental design techniques were applied in order to identify, screen, and control the parameters that affect the stencil printing process. The factors that affect the process were screened using Taguchi-based methodology. These significant factors and their interactions were then further analysed using full factorial designs. The volume and the quality of the solder paste deposits were considered as the response variables. Response surface plots were developed to provide process windows for paste deposition. Process capability studies were performed to evaluate the capability of the solder paste deposition process. Boards were assembled using optimal settings obtained from the experiments. No process-induced defects were found, and 100% yield was obtained.