Process design kit for flexible hybrid electronics

Abstract

Flexible Electronics (FE) is emerging for wearables and low-cost internet of things (IoT) nodes benefiting from its low-cost fabrication and mechanical flexibility. Combining FE with thinned silicon chips, known as flexible hybrid electronics (FHE), can take advantages of both low-cost printed electronics and high performance silicon chips. To design a FHE system, the process design kit (PDK) offering the capabilities for circuit design, simulation and verification for both FE and silicon chips is needed. The key elements of FHE-PDK include technology files for design rule checking (DRC), layout versus schematic (LVS) and layout parasitics extraction (LPE), as well as SPICE-compatible models for flexible thin-film transistors (TFTs) and passive elements. Wafer scale measurements are used to validate our SPICE models and design rules are derived accordingly to assure a satisfactory yield. With FHE-PDK, circuit and system designers can therefore focus on design innovations and can rely on design tools to produce manufacturable designs.