Process damage assessment of a low energy inductively coupled plasma-based neutral source

Abstract

In this article, we report process damage studies using a low energy inductively coupled plasma-based neutral stream source. Low energy neutrals are generated by the surface reflection neutralization method. Quasistatic capacitance-voltage measurement results of this work demonstrate that this low energy neutral source, which provides controllable fast neutrals for cleaning applications, induces much less damage than a pulsed inductively coupled plasma source. Most of the neutral process damage is caused by ultraviolet photons escaping from the plasma source zone. The process-induced damage by fast neutrals increases as the reflector bias is lowered. The fast neutral process damage also increases with the rf power. Unlike the neutral process-induced damage, the damage induced by pulsed plasmas is found to be a function of both the gas composition and rf pulsed frequencies.