Abstract
The design and process capability of board-level assembly of ceramic ball grid array (CBGA) packages with respect to their reliabilities were investigated. Two types of FEM models were built for elastic and elastic–plastic–creep analyses, respectively. The effect of PCB material, PCB thickness, and the thickness of ceramic substrate on solder joint deformation was discussed. It was shown that the variation in assembly process would cause the highest stress in the joints change by 10% from the mean value. The failure location and fatigue life under the temperature cycling condition were also studied. It was concluded that the prediction was close to the first failure in the test and would be seen as a conservative estimation.
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