Process and pad design optimization for 01005 passive component surface mount assembly

Abstract

PurposeThe ever present need for the miniaturization of electronic assemblies has driven the size of passive components to as small as the 01005 package size. However, the packaging standards for these components are still under development. The purpose of this work is to report results from experiments designed to establish optimum process parameters, pad sizes and component clearances for the surface mounting of 01005 passive components.Design/methodology/approachThe experiments were designed using MODDE, an experimental design software tool, and were carried out with both 01005 capacitors and resistors. All the assembled components were examined under microscope and judged according to industrial workmanship standards.FindingsIt was found that a viable solder paste printing process for the assembly of 01005 components can be achieved with a 75 μm thick stencil. Type 5 solder paste achieved a similar printing performance to type 4. Under the experimental conditions used, the optimum pad dimensions for the 01005 capacitors were 210 μm length, 220 μm width, 160 μm separation and for the resistors were 190 μm length, 220 μm width, 160 μm separation. The smallest component clearance to reliably avoid bridging was found to be 100 μm. A high placement force of 3.5 N was found to cause cracking of 01005 resistors.Originality/valueFrom this work, a surface mount process for 01005 passive components is established and it is concluded that electronics packaging density can be increased through the assembly of these small components. In the near future, the widespread use of them will definitely facilitate a further reduction in the size of electronic assemblies, especially in handheld and portable devices.