Abstract
A low-cost and non-destructive measurement technique based on the combination of a temperature sensor and a heater integrated in a very sharp tip is proposed for the determination of thermal conductivity of planar materials. The thermal sensor is fabricated by means of microtechnology technique. Associated to the system, an analytical thermal model is developed to express the measured Seebeck voltage as a function of the material thermal resistance. A numerical analysis based on COMSOL MultiphysicsⓇ is then developed to extract the thermal conductivity from the thermal resistance. To validate the approach proposed, experiments on planar dielectric materials and metals are conducted. Precision around 0.1 W m−1 K−1 for thermal conductivities lower than 2 W m−1 K−1 is obtained.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.