Abstract
In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and randomness which will affect the lifetime prediction quality. This paper focuses on solder joint reliability in tape-based chip-scale packages(CSP) with the consideration of uncertainties in material parameters.
Highlights
The chip-scale packaging technologies are widely used in electronic products, because of the increasing demand for smaller and more portable electronic devices
Over the traditional full-sized ball grid array (BGA), the main advantage of such package is that it saves a significant space
In Darveaux’s methodology using FEM, the number of cycles to initiate a crack, and the number of cycles for the crack to propagate across a solder joints diameter are expressed as a function of the strain energy density accumulated per cycle during thermal cycling
Summary
The chip-scale packaging technologies are widely used in electronic products, because of the increasing demand for smaller and more portable electronic devices. A combination of finite element methods with a thermal fatigue model is required[3]. In order to predict reliability of CSP, the used simulation tools are based on deterministic approaches which does not take into account the variability and randomness of input parameters. The Monte Carlo simulation (MCS) is widely used for uncertainty analysis. The complex nonlinear finite element analysis take more time to determine the time-dependent solder joint fatigue response, which makes the MCS application very expensive in term of computation. In order to efficiently overcome the computational cost, metamodel based probabilistic method is developed an applied to evaluate the reliability of CSP. The proposed method combine metamodel[2], MCS and FEM simulation
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