Abstract
A pneumatic drop-on-demand (DOD) system has been applied to solder complex and dense interconnects of modern micro electronic devices. Initial parameters of uniform droplets were first measured. Then influences of experiment parameters, such as the crucible temperature, the substrate temperature and the droplet velocity on spread of solder droplets, were investigated experimentally and theoretically. The results showed that effects of impact velocity on the spreading could be negligible and the solder spreading process was driven by capillary forces because of the low Weber (We) number of depositing droplet. The influence of initial droplet temperature on the droplet spreading was not regular. The contact diameter of solder droplets on copper substrate increased when the substrate temperature increased from 443K to 493K. At last, copper cables were successfully soldered to pins of a flexible circuit using the direct solder deposition and re-melting process. The soldering results showed the feasibility of the data-driven soldering technique using the pneumatic DOD deposition technology.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
