Printable Low Power Organic Transistor Technology for Customizable Hybrid Integration Towards Internet of Everything

Yukun Huang,Wei Tang,Bang Ouyang,Sujie Chen,Jiaqing Zhao,Lei Han,Xiaojun Guo,Linrun Feng,Zhe Liu

doi:10.1109/jeds.2020.3020118

Yukun Huang, Wei Tang + Show 7 more

Open Access

https://doi.org/10.1109/jeds.2020.3020118

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Abstract

A highly customizable hybrid sensor system, composed of a silicon integrated circuit (IC) chip and an organic field effect transistor (OFET) transducer, is proposed for Internet of Everything (IoE). In such a system, the silicon IC chip performs high performance and complex signal processing, and the OFET transducer provides flexible or conformable large area coverage and more friendly interfaces to integrate different sensing materials. A low trap-state density OFET (LTDOFET) technology is developed for such a hybrid system, owning features of low-cost solution printing processes, low operation voltage and excellent operational stability. This technology has been implemented with various materials and processes, indicating its generality. Several sensor applications built based on this device technology are also reviewed, proving the LTDOFET technology would be promising for highly customizable sensor systems towards the IoE era.

Highlights

Internet of Everything (IoE) aims to extend Internet connectivity beyond standard electronic devices, such as computers, smartphones and tablets, to any range of everyday objects [1]
The results prove generality of the technology for various organic semiconductor (OSC), and indicate the potential of continuous performance improvement
Low voltage organic field effect transistor (OFET) are realized by reducing the sub-gap trap-state density at the channel interface

Summary

INTRODUCTION

Internet of Everything (IoE) aims to extend Internet connectivity beyond standard electronic devices, such as computers, smartphones and tablets, to any range of everyday objects [1]. A common approach for short design-to-product time is through packaging the sensors with the readout and control electronics in a printed circuit board (PCB) [2] Such systems are difficult to address the requirements of cost, form factor and power, though a certain flexibility can be achieved by assembling components on a flexible PCB [3], [4]. Such technology routes would enable ease of customization for diverse sensing functions at low cost and with conformal coverage on non-planar object surfaces Most of these reported sensors used custom-designed PCB circuit board for signal readout and processing, which put constraints of the form factor, and cost of the overall systems [8], [9]. Output signals from the passive sensors need to pass through

HYBRID SYSTEM AND DEVICE REQUIREMENT

SENSOR APPLICATIONS

CONCLUSION