Abstract
With facile manufacturability and modifiability, impressive nanoparticles (NPs) assembly applications were performed for functional patterned devices, which have attracted booming research attention due to their increasing applications in high-performance optical/electrical devices for sensing, electronics, displays, and catalysis. By virtue of easy and direct fabrication to desired patterns, high throughput, and low cost, NPs assembly printing is one of the most promising candidates for the manufacturing of functional micro-chips. In this review, an overview of the fabrications and applications of NPs patterned assembly by printing methods, including inkjet printing, lithography, imprinting, and extended printing techniques is presented. The assembly processes and mechanisms on various substrates with distinct wettabilities are deeply discussed and summarized. Via manipulating the droplet three phase contact line (TCL) pinning or slipping, the NPs contracted in ink are controllably assembled following the TCL, and generate novel functional chips and correlative integrate devices. Finally, the perspective of future developments and challenges is presented and widely exhibited.
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