Abstract

With the advent of smart flexible electronic devices, new research directions have emerged. Among them, the resistive switching (RS) sensor has attracted much attention. The RS sensor converts the change of voltage signals into the change of resistance values. In this work, a planar flexible RS structure based on one-step printable silver electrodes was designed and fabricated to simplify device fabrication. The study is a starting point that paves the way for the development of all-in-one printable and flexible sensors in the future.

Highlights

  • Recent years have seen the emergence of flexible electronic devices and applications such as the Internet of Things (Ko et al, 2008; Kim et al, 2018; Luo et al, 2019; Wu et al, 2019; Xu et al, 2019; Zhang et al, 2019)

  • This study reports a printable and flexible silver-based planar resistive switching (RS) sensory device array in which the metal electrodes are in firm contact with the substrate, without stress mismatch, and the process does not require high-temperature heating

  • The area with deep contrast shows high conductivity (Moncrieff et al, 1978; Wang et al, 2012), which is related to the conductivity of silver

Read more

Summary

Introduction

Recent years have seen the emergence of flexible electronic devices and applications such as the Internet of Things (Ko et al, 2008; Kim et al, 2018; Luo et al, 2019; Wu et al, 2019; Xu et al, 2019; Zhang et al, 2019). The flexible resistive switching (RS) device has a sandwich structure in which the top electrode, the active layer, and the bottom electrode are sequentially stacked. The fabrication process of the flexible RS device is usually bottom-up (Han and Lee, 2016). The fabrication processes of growing the electrode are usually performed by evaporation (Sun et al, 2016) or chemical vapor deposition (Giulia et al, 2019), which can be time-consuming, have a high thermal budget and consume a large amount of energy. The three-layer material of the sandwich structure is prone to fracture during bending due to stress mismatch. Due to the fact that these sandwich-structure RS devices show high power consumption, complex fabrication processes, and limited applications, it is important to develop low-cost and simple-fabricated planar RS devices

Methods
Results
Conclusion
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.