Abstract
This paper adopts the segmented modeling method of via including the effect of power/ground plane pair. For this method, via structure is decomposed into three parts, and each part is modeled independently and then connected together. The extraction of the impedance of the power/ground plane pair Z pp is realized by using analytical formula, and then the impedance model Z pp is added into the equivalent circuit in the modeling of via. The modeling method is used to establish the model of via with decoupling capacitance and short-circuit via. Via with short column and complete switching via are also modeled using this method. The calculated results of the model match well with the simulation results of HFSS within 9 GHz, which demonstrates the effectiveness of the modeling method.
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