Abstract
Liquid Ni-31.7%Sn-2.5%Ge alloy was highly undercooled by up to 238 K (0.17TL) with glass fluxing and drop tube techniques. The dendritic growth velocity of primary Ni3Sn compound shows a power-law relation to undercooling and achieves a maximum velocity of 380 mm/s. The addition of Ge reduces its growth velocity as compared with the binary Ni75Sn25 alloy. A structural transition from coarse dendrites into equiaxed grains occurs once undercooling exceeds a critical value of about 125 K, which is accompanied by both grain refinement and solute trapping. The Ni3Sn intermetallic compound behaves like a normal solid solution phase showing nonfaceted growth during rapid solidification.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
