Abstract
We have developed pressureless silver sintering module using zirconia toughened alumina (ZTA) substrate made of active metal brazing (AMB) and SiC device for power module. The silver paste was printed with a metal mask of 80, 120, and 150 μm thickness, respectively. The void content was measured by x-ray images after pressureless silver sintering under a vacuum and nitrogen atmosphere. In order to evaluate the durability against thermal stress of the sintered module, the thermal cycle test (TC) and the high temperature storage test (HTS) were conducted. The void content and bond strength before and after the environment test were measured. As a result, the void content did not change, but the bonding strength was decreased after TC and increased after HTS. Crack was generated at between silver sintered joint and ZTA substrate after TC test. Also, we observed that Cu-Ag alloy layer was formed between the copper AMB and silver sintered layer after HTS, which finally leaded to improve the bonding strength. Key words: Power module, Silver paste, Pressureless, Silver sintering, Bonding strength, Interface
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