Abstract
The electronics manufacturing industry is facing one of its biggest challenges in years. EU directives on waste of electrical equipment and the restriction of hazardous materials used in these products mean that conventional tin-lead solders will be prohibited in the printed circuit board (PCB) manufacturing process as of July 2006. In terms of, impact within the electronics industry, preparing for this transition will be not dissimilar to the challenges presented by the Y2K bug at the turn of the century. In addition to the impact on manufacturing processes, there will also be significant implications on producers' supply chain strategies, inventory control, IT systems and operational logistics. Like Y2K, the industry is working against a non-negotiable timeframe. However, key to meeting the July 2006 deadline is the establishment of a strong, all-encompassing strategy that not only meets the technical challenges, but also addresses the many logistical issues likely to arise. Collaboration alone does not guarantee a successful process transition. Printed circuit producers must allow sufficient time to fully qualify their internal manufacturing processes. The author looks at how this will require the extensive testing of materials and equipment.
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