Abstract
The tungsten (W)-plated diamond process was explored and optimized. A dense and uniform tungsten coating with a thickness of 900 nm was successfully prepared by the powder covering sintering method. The Diamond-WC-Cu composite with high density and high thermal conductivity were successfully prepared by cyclic vacuum pressure infiltration. The microstructure and composition of the W-plated diamond particles were analyzed. The effect of tungsten coating on the microstructure and thermal conductivity of the Diamond-WC-Cu composite was investigated. After calculation, the interface thermal resistance of the composite forming the tungsten carbide transition layer is 2.11 × 10−8 m2∙K∙W−1. The thermal conductivity average value of the Diamond-WC-Cu composite with a diamond volume fraction of 60% reaches 874 W∙m−1∙K−1, which is close to the theoretical prediction value of Hasselman-Johnson (H-J) model and differential effective medium (DEM) model. Moreover, the Maxwell-Eucken (M-E) model, H-J model, and DEM model were used to evaluate the thermal conductivity of the Diamond-WC-Cu composite.
Highlights
Thermal Conductivity of Diamond-With the rapid development of microelectronic technology and aerospace technology, the integration of semiconductor circuits is becoming higher and higher
Red copper is widely used in the field of thermal management due to its high thermal conductivity (400 W·m−1 ·K−1 )
If the alloying elements remain in the copper matrix, the thermal conductivity of the diamond/copper composites will decrease sharply
Summary
With the rapid development of microelectronic technology and aerospace technology, the integration of semiconductor circuits is becoming higher and higher. In the process of sample preparation, alloying elements will diffuse in the liquid copper to the diamond surface and react with carbon atoms on the surface of diamond to form carbides, which enhances the interface bonding state and greatly improves the wettability of the copper matrix to the diamond. If the alloying elements remain in the copper matrix, the thermal conductivity of the diamond/copper composites will decrease sharply. Another method is the surface modification of diamonds. The formation of the carbide transition layer can effectively improve the thermal properties of composites and avoid the negative effects of adding alloying elements. The composite can be used as a thermal management material
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