Abstract
The optimization of manufacturing conditions for reed straw‐based particleboard by soy‐based adhesive was performed through response surface methodology. The interactions of various conditions, including adhesive amount, hot‐pressing temperature, and hot‐pressing time on wet internal bonding strength were investigated. A 3‐level‐3‐factor Box–Behnken design was used to test the optimal preparation conditions of reed straw particleboard. The polynomial regression model for manufacturing conditions had a very significant level (p < 0.01). In addition, the determination coefficient (R2) and the adjust determination coefficient () of this model were found to be 0.969 and 0.9292, respectively. The conditions optimized by the model were 25% of adhesive amount, 138°C of hot‐pressing temperature, and 27 min of hot‐pressing time. Under the optimal conditions, validation tests were performed, and the average value of parallel experiments was 0.17 ± 0.02 MPa. Moreover, the thickness swelling of water absorption after soaking and mechanical properties (MOE and MOR) of samples prepared under optimized conditions were further measured, which all met the requirement of Type P6 particleboard. It could provide an efficient method for massive production of reed straw particleboard.
Highlights
Academic Editor: Antonio Boccaccio e optimization of manufacturing conditions for reed straw-based particleboard by soy-based adhesive was performed through response surface methodology. e interactions of various conditions, including adhesive amount, hot-pressing temperature, and hot-pressing time on wet internal bonding strength were investigated
It could provide an efficient method for massive production of reed straw particleboard
Optimal manufacturing conditions were obtained by using Response surface methodology (RSM). e effects and interactions of adhesive amount, hot-pressing temperature, and hot-pressing time on wet internal bonding strength of reed straw particleboard with SBA as the binder were investigated
Summary
Academic Editor: Antonio Boccaccio e optimization of manufacturing conditions for reed straw-based particleboard by soy-based adhesive was performed through response surface methodology. e interactions of various conditions, including adhesive amount, hot-pressing temperature, and hot-pressing time on wet internal bonding strength were investigated. A series of nonwood plants and agricultural and forestry wastes have been developed as the raw materials of particleboard, such as wheat straw [4, 5], corn pith [6], cotton stalks [7], rice husk [8, 9] and rice straw [10], waste grass clippings [11], branch wood and bark [12], reed straw [13], and bagasse [14], which can all be employed as alternative materials All these wastes can be used as the raw materials for adhesives, bioethanol, chemicals, and particleboard [15, 16]. Ough these resins are economical with excellent adhesion properties, they are petroleum-based and nonrenewable It can release formaldehyde during the production process and product applications, which pose health hazards to workers in the particleboard manufacturing and end use consumers. This could encourage the development of environment-friendly adhesives
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