Abstract
Surface modification of hexagonal boron nitride (h-BN) has the problem of reducing the interfacial thermal resistance, which has hindered its application in thermal conductive composites. Herein, poly glycidyl methacrylate (PGMA) chains were grafted onto the h-BN surface by simple radical polymerization; the thermal conductivity of epoxy (EP) composites was improved by adding the as-grafted h-BN–PGMA to EP resin. When the filling volume of h-BN–PGMA was 4, 10 or 16 vol%, the thermal conductivity of EP composite increased by 160%, 298% or 599%, respectively. Moreover, the h-BN surface modification was beneficial to enhance the compatibility between the filler and the EP matrix. Compared to EP/h-BN, the EP/h-BN–PGMA had higher thermal conductivity (1.197 W m−1 K−1) under the same filling amount (16 vol%). Moreover, excellent dielectric properties and thermal stability indicated that EP/h-BN–PGMA composites were excellent thermal interface materials (TIMs) and could be applied in the field of thermal management. The preparation process is environmentally friendly, easy to operate, and suitable for large-scale practical applications.
Highlights
Epoxy resin (EP) is widely used in the process of electronic packaging substrates, which makes the electronic devices exhibit long service life and good performance.[1]
It is well known that the incorporation of highly thermally conductive ceramic particles such as aluminum nitride (AlN),[6] alumina (Al2O3),[7] silicon carbide (SiC),[8] silicon nitride (Si3N4)[9] into the polymer matrix can greatly improve the thermal conductivity of composites
A condensation re ux tube, 1 g of hexagonal boron nitride (h-BN)–MPMS and 10 ml of GMA were placed in 200 ml of DMF solvent, the obtained dispersion liquid was heated to 55 C, and the solution was stirred under N2 atmosphere, 0.083 g of weighed BPO was slowly added to the above reaction device, the reaction was continued for 12 h, and nally the as-prepared h-BN–poly glycidyl methacrylate (PGMA) was obtained, and subsequently dispersed in ethanol for later use
Summary
It is well known that the incorporation of highly thermally conductive ceramic particles such as aluminum nitride (AlN),[6] alumina (Al2O3),[7] silicon carbide (SiC),[8] silicon nitride (Si3N4)[9] into the polymer matrix can greatly improve the thermal conductivity of composites. The base-EP composites prepared by blending epoxy resin and BN ller or modi ed BN ller usually showed lower thermal conductivity than EP/h-BN–PGMA composites in this work, except for EP/BN/ AgNPs composite.[18] through the various studies shown, the h-BN–PGMA ller with a lling amount of less than 18 vol% was nally selected for ideal llers. We selected a large aspect ratio h-BN to construct a thermal network with a low percolation threshold and established multiple PGMA macromolecular chain growth active points to achieve an enhancement of the interfacial interaction between h-BN and EP resin, and to improve the thermal conductivity of the EP matrix composites
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