Abstract
The growth characteristics of Pb(ZrxTi1 - x)O3 thin films on three-dimensional (3D) electrodes were investigated for the application to high-density ferroelectric random access memory (FeRAM) devices. PZT films have been grown on Ir coated trench structures having aspect ratio of 1.2 by liquid delivery-metal organic chemical vapor deposition (LD-MOCVD). Atomic layer deposited (ALD) Ir electrode showed good step coverage and electrical properties. MOCVD PZT films showed step coverage of 90% at the deposition temperature of 500°C, while it is decreased to 63% at 550°C. Compositional non-uniformity of PZT along the sidewall was greatly affected by the types of the metal organic sources.
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