Abstract
Particleboard was manufactured using dialdehyde starch (DAS) as the adhesive and corn stalk as the matrix. The adhesive was prepared via the oxidation of tapioca starch in sodium periodate. The DAS was characterized by Fourier transform infrared (FTIR) spectroscopy. The effect of the hot pressing temperature, board density, and DAS dosage on the physical properties of particleboard was studied. The cross-section morphology of particleboard was observed via scanning electron microscopy (SEM). The absorption peak of the aldehyde group appeared at 1731 cm-1 after the tapioca starch was oxidized by sodium periodate, indicating that DAS had formed. Both the modulus of rupture (MOR) and modulus of elasticity (MOE) increased first and then decreased, with the increase of hot pressing temperature, board density, and DAS dosage. Within a certain range, the increase of hot pressing temperature, board density, and DAS dosage reduced the thickness swelling (TS) and improved the particleboard water resistance. During the particleboard hot pressing process, DAS filled the spaces of the corn stalk and acted as an adhesive to bind the corn stalks tightly together, thereby improving the physical, mechanical, and water resistance properties of the particleboard.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
