Preparation of p-Phenylenediamine Modified Graphene Foam/Polyaniline@Epoxy Composite with Superior Thermal and EMI Shielding Performance.

Liusi Wang,Shuxing Xiao,Mohan Zhu,Haoliang Li,Junhe Yang

doi:10.3390/polym13142324

Liusi Wang, Shuxing Xiao + Show 3 more

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https://doi.org/10.3390/polym13142324

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Journal: Polymers	Publication Date: Jul 15, 2021
Citations: 9	License type: CC BY 4.0

Affiliation: University of Shanghai for Science and Technology

Abstract

With the development of integrated devices, the local hot spot has become a critical problem to guarantee the working efficiency and the stability. In this work, we proposed an innovative approach to deliver graphene foam/polyaniline@epoxy composites (GF/PANI@EP) with improvement in the thermal and mechanical property performance. The graphene foam was firstly modified by the grafting strategy of p-phenylenediamine to anchor reactive sites for further in-situ polymerization of PANI resulting in a conductive network. The thermal conductivity (κ) and electromagnetic interference shielding (EMI) performance of the optimized GF/PANI4:1@EP is significantly enhanced by 238% and 1184%, respectively, compared to that of pristine EP with superior reduced modulus and hardness. Such a method to deliver GF composites can not only solve the agglomeration problem in traditional high content filler casting process, but also provides an effective way to build up conductive network with low density for thermal management of electronic devices.

Highlights

With the integration and miniaturization of electronic equipment, heat dissipation in time has become a huge challenge to guarantee the performance and life of the electronic equipment [1,2]
After the in-situ polymerization, as displayed in Figure 2c–e, the fibrous PANI is attached onto the surface of GF/PANI filler
Both the SEM image and the EDX mapping of GF/PANI4:1 in Figure 2e–h exhibits a uniform distribution of PANI covered on the graphene sheets forming a continuous network

Summary

Introduction

With the integration and miniaturization of electronic equipment, heat dissipation in time has become a huge challenge to guarantee the performance and life of the electronic equipment [1,2]. The traditional thermal interface materials (TIM), with extremely high loading (up to ~70%) of thermal conductive fillers such as silicone grease or aluminum oxide, can hardly meet the demand, due to the low thermal conductivity (κ, only 1–5 W m−1 K−1 ), strong fluidity (pump out leakage from the devices) and the poor dispersion of particle fillers [3,4,5]. Synthesized a multilayer graphene composite with more than 10 vol% loading with an enhancement by 10 times in κ of the pristine matrix [10].

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Results

Conclusion