Abstract

Nano-silver paste, as an important basic material for manufacturing thick film components, ultra-fine circuits, and transparent conductive films, has been widely used in various fields of electronics. Here, aiming at the shortcomings of the existing nano-silver paste in printing technology and the problem that the existing printing technology cannot achieve the printing of high viscosity, high solid content nano-silver paste, a nano-silver paste suitable for electric-field-driven (EFD) micro-scale 3D printing is developed. The result shows that there is no oxidation and settlement agglomeration of nano-silver paste with a storage time of over six months, which indicates that it has good dispersibility. We focus on the printing process parameters, sintering process, and electrical conductivity of nano-silver paste. The properties of the nano-silver paste were analyzed and the feasibility and practicability of the prepared nano-silver paste in EFD micro-scale 3D printing technology were verified. The experiment results indicate that the printed silver mesh which can act as transparent electrodes shows high conductivity (1.48 Ω/sq) and excellent transmittance (82.88%). The practical viability of the prepared nano-silver paste is successfully demonstrated with a deicing test. Additionally, the experimental results show that the prepared silver mesh has excellent heating properties, which can be used as transparent heaters.

Highlights

  • Electronic paste is an electronic functional material that integrates metallurgy, the chemical industry, and electronic technology

  • The price of copper and aluminum is relatively low and both of them have excellent electrical conductivity, but copper powder and aluminum powder are oxidized during storage, and the electrical conductivity is reduced, which limits their applications in electronic paste

  • We provide a method for preparing nano-silver paste used for EFD micro-scale 3D printing

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Summary

Introduction

Electronic paste is an electronic functional material that integrates metallurgy, the chemical industry, and electronic technology. Among the metal-based materials, gold has the best conductivity, but the price of gold is relatively high and the reserve content is low, which limits the further application of gold powder. Lei [25] developed an electrohydrodynamic (EHD) jet printing strategy based on in situ reactive inks to fabricate microscale conductive silver features. Most the nano-silver pastes and nano-silver inks are developed according to the matching of printing and manufacturing processes Whether it is contact printing technology (screen printing, intaglio printmaking) or non-contact printing technology (aerosol jet printing, inkjet printing), different printing technologies have different performance requirements for different printing materials. For non-contact printing technology, such as inkjet printing technology, it is only suitable for the printing of silver inks with low viscosity (generally less than 30 mPa·s) and cannot achieve the printing of silver pastes with high viscosity and high solid content [28,29]. We discuss and analyze the fabrication details and properties of the silver paste and the printing characteristics of silver paste via EFD micro-scale 3D printing technology

Materials
Preparation of Nano-Silver Paste
EFD Micro-Scale 3D Printing Technology
Testing Results of the Nano-Silver Paste
The Sintering and Curing of fNiealdnofo-Srcilever Paste Tangential electric
Geometric Morphology of the Printed Silver Wires
Photoelectric Properties of the Printed Silver Mesh
Practical Application Performance of the Printed Silver Mesh
Conclusions

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